Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)

von Seonho Seok

Taschenbuch

ISBN-13: 978-3-030-08561-2

ISBN-10: 3-030-08561-9

Springer · Mai 2019

Siehe auch:
2018	Gebundene Ausgabe	Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)